The global semiconductor company MediaTek has launched another chipset in their Dimensity series of 5G chipsets. This chipset will be soon integrated in flagship 5G smartphones which will be launched in India next year. Let us have a look at the features of this chipset.
MediaTek Dimensity 1000+ Chipset
This is an enhanced 5G integrate chip which is having upgraded video playback, gaming, connectivity and power efficiency. The 7nm Dimensity 1000+ is world’s most advanced integrated 5G SoC as per the company. It is able to deliver high end and premium user experience.
5G capabilities are unlocked using this chipset which includes faster speeds, carrier aggregation (2CC 5G-CA), 5G Sim and also UltraSave Power technology feature which helps to improve the battery life of the smartphone. This will help the user to use the battery more and charge less often and getting the most of the battery usage.
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The MediaTek MiraVision has enhanced display technologies like AI Picture Quality, HDR10+ playback and resolution upscaling. This will help to make the screen look premium indeed.
MediaTek HyperEngine game technology helps to get more reliable and responsive gaming experience. It has advanced and adaptable camera support. So it is HDR native and ISP will support upto quad camera sensors and upto 64MP sensors.
User can load apps faster, do multi tasking with ease because of this chipset. It is having Quad Channel LPDDR4X Memory and comes with ultra fast UFS 2.2 2-lance storage. Another feature which we liked about this chipset is the multi exposure 4K HDR video support. It is capable of night ready video capture with clear details. You can also record Real time video bokeh in live view and also while recording. It is having MediaTek APU 3.0 with 4.5 TOPs performance.
Also Read : MediaTek Helio G35 and G25 Gaming Series Chipsets announced
As per the company MediaTek 5G UltraSave uses 40% less power than the competitors. Upto 4.7Gbps 5G NR download speeds can be achieved using this chipset. It also supports Gigabit WiFi 6 and latest Bluetooth 5.1 standards. It also comes with unique sensor fusion location technology.
This chipset will be used in flagship smartphones, connectivity and also routers and other smart devices in the next year.